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Smart thermal imaging camera launched by MultiPix

These models combine a high quality camera head including lens with on-board, DSP-based control and communication, TCP/IP and CL, ample processing power for intelligent real-time image correction and recognition and video interface.

Main application areas for the new cameras are thermal imaging in the automotive, maritime and aviation industries, as well as non-contact temperature measurement and hyperspectral imaging. Typical industry areas include not just the security sector but also the firefighting arena.

XenICs bases its new Gobi-384 on an uncooled microbolometer array for high-performance imaging, delivering 384 x 288 pixels on a 25 mum pixel pitch. This yields a 44% higher pixel count than with 320 x 240 cameras. Pixel operability is >99.9%.

Silent and uninterrupted operation

The cameras cover the long wave infrared wavelength area 8 mum-14 mum. They work without thermoelectric cooling and are shutterless, delivering the benefit of silent and uninterrupted operation.

Compared to competitors’ offerings, MultiPix states that the XenICs Gobi excels by its on-board, DSP-based calculating power. Image processing takes place inside the camera, using 16 bit ADCs.

The cameras offer end users full flexibility regarding system integration and customisation.

Gobi is also available as an OEM module.

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